Umenzi wePCB okhuphisanayo

ukuntywiliselwa kwicala elinye igolide Ceramic esekelwe kwiBhodi

Inkcazelo emfutshane:

Uhlobo lwezinto eziphathekayo: isiseko se-ceramic

Ubalo lomaleko: 1

Ububanzi obuncinane bokulandelela/isithuba: 6 mil

Ubungakanani bomngxuma omncinci: 1.6mm

Ubunzima bebhodi obugqityiweyo: 1.00mm

Ubunzima bobhedu obugqityiweyo: 35um

Gqiba: ENIG

Umbala wemaski yeSolder: blue

Ixesha lokukhokela: iintsuku ezili-13


Iinkcukacha zeMveliso

Iithegi zeMveliso

Uhlobo lwezinto eziphathekayo: isiseko se-ceramic

Ubalo lomaleko: 1

Ububanzi obuncinane bokulandelela/isithuba: 6 mil

Ubungakanani bomngxuma omncinci: 1.6mm

Ubunzima bebhodi obugqityiweyo: 1.00mm

Ubunzima bobhedu obugqityiweyo: 35um

Gqiba: ENIG

Umbala wemaski yeSolder: blue

Ixesha lokukhokela: iintsuku ezili-13

ceramic based board

I-Ceramic substrate ibhekisa kwifoyile yobhedu kwiqondo lobushushu eliphezulu elidityaniswe ngokuthe ngqo kwi-aluminiyam oxide (Al2O3) okanye i-aluminiyam nitride (AlN) umphezulu we-ceramic substrate (enye okanye kabini) ipleyiti yenkqubo ekhethekileyo.I-Ultra-thin Composite substrate inokusebenza okugqwesileyo kokufakelwa kombane, ukuguquguquka okuphezulu kwe-thermal, ipropathi egqwesileyo ethambileyo yokuqhafaza kunye namandla ancamatheleyo aphezulu, kwaye inokufaka zonke iintlobo zegraphics njengebhodi yePCB, enomthamo omkhulu wangoku wokuthwala.Ke ngoko, i-substrate ye-ceramic ibe yeyona nto isisiseko setekhnoloji yamandla aphezulu wesekethe ye-elektroniki kunye netekhnoloji yonxibelelwano.

I-advanteji yebhodi esekwe kwiceramic:

Uxinzelelo olunamandla lomatshini, imilo ezinzileyo;Amandla aphezulu, ukuhanjiswa kwe-thermal ephezulu, ukugquma okuphezulu;Ukubambelela okuqinileyo, ukuchasana nokubola.

◆ Ukusebenza kakuhle komjikelo we-thermal, amaxesha okujikeleza ukuya kuma-50,000 amaxesha, ukuthembeka okuphezulu.

◆ Ubume bemizobo eyahlukeneyo bunokufakwa njenge-PCB (okanye i-IMS substrate);Akukho lungcoliso, akukho ngcoliseko.

◆ Ubushushu benkonzo ngu-55℃ ~ 850℃;I-coefficient yokwandisa i-thermal isondele kwi-silicon, eyenza lula inkqubo yokuvelisa imodyuli yamandla.

Ukusetyenziswa kwebhodi ye-ceramic:

I-Ceramic substrates (i-alumina, i-aluminiyam nitride, i-silicon nitride, i-zirconia kunye ne-zirconia eqinisa i-alumina eyi-ZTA) ngenxa yeempawu zayo ezibalaseleyo zokushisa, umatshini, iikhemikhali kunye ne-dielectric, zisetyenziswa ngokubanzi kwi-semiconductor chip packaging, izinzwa, unxibelelwano lwe-elektroniki, iiselfowuni kunye enye i-terminal ekrelekrele, izixhobo kunye neemitha, amandla amatsha, umthombo wokukhanya omtsha, uloliwe ohamba ngesantya esiphezulu esizihambelayo, amandla omoya, iirobhothi, i-aerospace kunye nomkhosi wokhuselo kunye namanye amasimi obuchwepheshe obuphezulu.Ngokutsho kwezibalo, minyaka le ezahlukeneyo zeceramic ixabiso substrate yafikelela amashumi eebhiliyoni kwimarike, ingakumbi kwiminyaka yakutshanje, kunye nophuhliso olukhawulezayo China kwizithuthi amandla amatsha, kaloliwe-high-speed kunye nezikhululo 5 g isiseko, imfuno ceramic substrate inkulu, kuphela emotweni. indawo, ubungakanani bemfuno ngonyaka ngamnye ukuya 5 million PCS;I-substrate ye-alumina ye-ceramic ayisetyenziswanga kuphela kumashishini ombane kunye ne-elektroniki, kodwa nakwi-sensor yoxinzelelo kunye ne-LED yokutshatyalaliswa kobushushu.

Isetyenziswa ngokuphindaphindiweyo kwiindawo ezi-5 ezilandelayo:

Imodyuli ye-1.IGBT ye-high-speed train, izithuthi zamandla amatsha, ukuveliswa kwamandla omoya, iirobhothi kunye nezikhululo zesiseko ze-5G;

2.I-backplane yefowuni ehlakaniphile kunye nokuqatshelwa kweminwe;

3.Isizukulwana esitsha seeseli eziqinileyo zamafutha;

I-4.Inzwa entsha ye-flat plate pressure sensor kunye ne-oxygen sensor;

I-5.LD / i-LED yokutshatyalaliswa kobushushu, inkqubo ye-laser, isiphaluka esihlanganisiweyo se-hybrid;


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    IINDIDI ZEMVELISO

    Gxininisa ekuboneleleni ngezisombululo zemong pu iminyaka emi-5.