Ukhuphiswano loMvelisi wePCB

ii-multilayer eziPhakamileyo zeBhodi ye-TG ngokuntywiliselwa kwegolide kwimodem

Inkcazo emfutshane:

Uhlobo lwezinto: FR4 Tg170

Ulwaleko lobeko: 4

Min umkhondo ububanzi / indawo: 6 mil

Min ubungakanani umngxuma: 0.30mm

Kugqityiwe ubukhulu ibhodi: 2.0mm

Ukugqitywa kobhedu kugqityiwe: 35um

Gqiba: ENIG

Umbala wesigqubuthelo sesolder: luhlaza “

Ixesha Lead: iintsuku ezili-12


Iinkcukacha Product

Iimpawu zemveliso

Uhlobo lwezinto: FR4 Tg170

Ulwaleko lobeko: 4

Min umkhondo ububanzi / indawo: 6 mil

Min ubungakanani umngxuma: 0.30mm

Kugqityiwe ubukhulu ibhodi: 2.0mm

Ukugqitywa kobhedu kugqityiwe: 35um

Gqiba: ENIG

Umbala we-Solder mask: luhlaza ''

Ixesha Lead: iintsuku ezili-12

High Tg board

Xa ubushushu bebhodi yesekethe ephezulu ye-TG inyukela kwingingqi ethile, i-substrate iya kutshintsha ukusuka "kwiglasi yeglasi" iye "kurabha wombuso", kwaye ubushushu ngeli xesha kuthiwa bubushushu beglasi (Tg) kwipleyiti. Ngamanye amagama, i-Tg lelonaqondo lobushushu liphezulu (℃) apho i-substrate ihlala iqinile. Oko kukuthi, izinto eziqhelekileyo ze-PCB ze-substrate kubushushu obuphezulu azivelisi kuphela ukuthamba, ukunyibilika, ukunyibilika kunye nezinye izinto, kodwa ikwabonisa ukwehla okubukhali kwiipropathi zoomatshini nezombane (andiqondi ukuba ufuna ukubona iimveliso zabo zivela kweli tyala ).

Amacwecwe ngokubanzi e-Tg angaphezu kwe-130 degrees, i-Tg ephezulu ngokubanzi ingaphezulu kwe-170 degrees, kwaye i-Tg ephakathi imalunga ne-150 degrees.

Ngokwesiqhelo, i-PCB ene-Tg≥170 called ibizwa ngokuba yibhodi yesekethe ephezulu ye-Tg.

I-Tg ye-substrate iyanda, kwaye ukuxhathisa ubushushu, ukuxhathisa ukufuma, ukumelana neekhemikhali, ukumelana nozinzo kunye nezinye izinto zebhodi yesekethe ziya kuphuculwa kwaye ziphuculwe. Ixabiso eliphezulu le-TG, kokukhona kuya kuba ngcono ukusebenza kokumelana nobushushu kwipleyiti. Ngokukodwa kwinkqubo engenasiphelo, i-TG ephezulu ihlala isetyenziswa.

I-Tg ephezulu ibhekisa kukumelana nobushushu obuphezulu. Ngophuhliso olukhawulezileyo lweshishini le-elektroniki, ngakumbi iimveliso zombane ezimelwe ziikhompyuter, ngokubhekisele kuphuhliso lomsebenzi ophezulu, kwimultilayer ephezulu, isidingo semathiriyeli yePCB yomgangatho ophezulu wokumelana nobushushu njengesiqinisekiso esibalulekileyo. Ukuvela kunye nophuhliso lwetekhnoloji yokufaka uxinizelelo oluphezulu emelwe yi-SMT kunye ne-CMT yenza ukuba i-PCB ixhomekeke ngakumbi kwinkxaso yobushushu obuphezulu be-substrate ngokwembonakalo encinci, intambo entle kunye nohlobo olucekeceke.

Ke ngoko, umahluko phakathi kwesiqhelo se-FR-4 kunye ne-high-TG FR-4 kukuba kwimeko ye-thermal, ngakumbi emva kwe-hygroscopic kunye nobushushu, amandla oomatshini, uzinzo olubonakalayo, ukunamathela, ukufunxwa kwamanzi, ukubola kwe-thermal, ukwanda kwe-thermal kunye nezinye iimeko ze izinto ezahlukeneyo. Iimveliso eziphezulu zeTg ngokucacileyo zingcono kunezinto eziqhelekileyo ze-PCB substrate. Kwiminyaka yakutshanje, inani labathengi abafuna ibhodi yesekethe ephezulu ye-Tg inyukile unyaka nonyaka.


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