Ukhuphiswano loMvelisi wePCB

  • quick turn prototype gold plating PCB with Counter sink hole

    ukujika okukhawulezayo komzekelo wegolide we-PCB kunye ne-Counter hole hole

    Uhlobo lwezinto: FR4

    Ulwaleko lobeko: 4

    Min umkhondo ububanzi / indawo: 6 mil

    Min ubungakanani umngxuma: 0.30mm

    Kugqityiwe ubukhulu bebhodi: 1.20mm

    Ukugqitywa kobhedu kugqityiwe: 35um

    Gqiba: ENIG

    Umbala wesigqubuthelo sesolder: luhlaza “

    Ixesha Lead: iintsuku 3-4

  • Low Volume medical PCB SMT Assembly

    Umthamo Low zonyango PCB Assembly

    I-SMT sisifinyezo seTekhnoloji ePhambili yokuPhezulu, eyonaTekhnoloji idumileyo kunye nenkqubo kwishishini lendibano ye-elektroniki. Isekethe yeKhompyuter yeTekhnoloji yeNtaba yeNtaba (SMT) ibizwa ngokuba yiSurface Mount okanye iTurface Mount Technology. Luhlobo lwetekhnoloji yendibano yesekethe efakela izinto ezingenamkhokeli okanye ezifutshane zecandelo lendibano (i-SMC / SMD ngesiTshayina) kumphezulu weBhodi yeSekethe eprintiweyo (i-PCB) okanye omnye umhlaba we-substrate, emva koko i-welds kwaye ihlangana ngendlela yokuhambisa kwakhona nkxu welding.

  • single sided immersion gold Ceramic based Board

    Ukucwiliswa kwebhodi yegolide esekwe kwibhola enye

    Uhlobo lwezinto: isiseko se ceramic

    Ulwaleko lobeko: 1

    Min umkhondo ububanzi / indawo: 6 mil

    Min ubungakanani umngxuma: 1.6mm

    Kugqityiwe ubukhulu bebhodi: 1.00mm

    Ukugqitywa kobhedu kugqityiwe: 35um

    Gqiba: ENIG

    Umbala we-Solder mask: luhlaza okwesibhakabhaka

    Ixesha Lead: iintsuku ezili-13

  • fast multilayer High Tg Board with immersion gold for modem

    ii-multilayer eziPhakamileyo zeBhodi ye-TG ngokuntywiliselwa kwegolide kwimodem

    Uhlobo lwezinto: FR4 Tg170

    Ulwaleko lobeko: 4

    Min umkhondo ububanzi / indawo: 6 mil

    Min ubungakanani umngxuma: 0.30mm

    Kugqityiwe ubukhulu ibhodi: 2.0mm

    Ukugqitywa kobhedu kugqityiwe: 35um

    Gqiba: ENIG

    Umbala wesigqubuthelo sesolder: luhlaza “

    Ixesha Lead: iintsuku ezili-12

  • 1.6mm fast prototype standard FR4 PCB

    I-1.6mm prototype ekhawulezileyo ye-FR4 PCB

    Uhlobo lwezinto: FR-4

    Ulwaleko lobeko: 2

    Min umkhondo ububanzi / indawo: 6 mil

    Min ubungakanani umngxuma: 0.40mm

    Kugqityiwe ubukhulu ibhodi: 1.2mm

    Ukugqitywa kobhedu kugqityiwe: 35um

    Gqibezela: khokela i-HASL yasimahla

    Umbala we-Solder mask: luhlaza

    Ixesha Lead: iintsuku eziyi-8

  • Resin plugging hole Microvia Immersion silver HDI with laser drilling

    Umngxuma wokufaka umngxunya kwi-HDI yesilivere yokuntywila ngesilivere

    Uhlobo lwezinto: FR4

    Ulwaleko lobeko: 4

    Min umkhondo ububanzi / indawo: 4 mil

    Min ubungakanani umngxuma: 0.10mm

    Kugqityiwe ubukhulu bebhodi: 1.60mm

    Ukugqitywa kobhedu kugqityiwe: 35um

    Gqiba: ENIG

    Umbala we-Solder mask: luhlaza okwesibhakabhaka

    Ixesha Lead: iintsuku ezili-15

  • 6 layer impedance control rigid-flex board with stiffener

    Ulawulo lwe-6 lwe-impedance yolawulo oluqinileyo-lwebhodi ene-stiffener

    Uhlobo lwezinto: FR-4, polyimide

    Min umkhondo ububanzi / indawo: 4 mil

    Min ubungakanani umngxuma: 0.15mm

    Kugqityiwe ubukhulu ibhodi: 1.6mm

    Ubungakanani be-FPC: 0.25mm

    Ukugqitywa kobhedu kugqityiwe: 35um

    Gqiba: ENIG

    Umbala we-Solder mask: obomvu

    Ixesha Lead: iintsuku ezingama-20

  • Thin Polyimide bendable FPC with FR4 stiffener

    Thin Polyimide bendable FPC nge FR4 stiffener

    Uhlobo Material: polyimide

    Ulwaleko lobeko: 2

    Min umkhondo ububanzi / indawo: 4 mil

    Min ubungakanani umngxuma: 0.20mm

    Kugqityiwe ubukhulu bebhodi: 0.30mm

    Ukugqitywa kobhedu kugqityiwe: 35um

    Gqiba: ENIG

    Umbala we-Solder mask: obomvu

    Ixesha Lead: iintsuku ezili-10

  • 3 oz solder mask plugging ENEPIG heavy copper board

    I-3 oz solder mask efaka i-ENEPIG kwibhodi yobhedu enzima

    Ii-PCB zeCopper ezinzima zisetyenziswa kakhulu kwiinkqubo zeMbane ze-Elektroniki kunye nePower apho kukho imfuneko yangoku ephezulu okanye ukubakho kokudubula ngokukhawuleza kwempazamo yangoku. Ubunzima bobhedu obonyukayo bunokujika ibhodi ye-PCB ebuthathaka ibe yindawo eqinileyo, ethembekileyo, kunye nehlala ixesha elide kwaye igates imfuno yokongezwa kweendleko kunye nezinto ezinamandla ezinje ngezixhobo zokufudumeza, iifeni, njl.

  • 8.0W/m.k high thermal conductivity MCPCB for Electric torch

    8.0W / mk ukuqhuba okuphezulu kobushushu kwi-MCPCB yetotshi yombane

    Uhlobo lwentsimbi: Isiseko seAluminiyam

    Inani leengqimba: 1

    Umphezulu: Khokela i-HASL yasimahla

    Plate ubukhulu: 1.5mm

    Ubunzima beCopper: 35um

    Ukuqhuba kobushushu: 8W / mk

    Ukumelana nobushushu: 0.015 ℃ / W.