Ukhuphiswano loMvelisi wePCB

Hlela izinto Amandla aqhelekileyo Amandla akhethekileyo

ubalo lwamaleko

Ngqongqo-flex PCB 2-14 2-24
  Flex PCB 1-10 1-12

Ibhodi

  0.08 +/- 0.03mm 0.05 +/- 0.03mm
  Min. Ukutyeba    
  Ubukhulu. Ukutyeba 6mm 8mm
  Ubukhulu. Ubungakanani 485mm * 1000mm 485mm * 1500mm
Umngxunya kunye neSlot Ubuncinci Ubungakanani: 0.05mm
  Imigca yeSlot Hole 0.6mm 0.5mm
  Umgangatho wento

10:01

12:01

Umkhondo Ububanzi / isithuba 0.05 / 0.05mm 0.025 / 0.025mm
Ukunyamezelana Khuphela W / S. ± 0.03mm ± 0.02mm
    (W / S≥0.3mm: ± 10%) (W / S≥0.2mm: ± 10%)
  Umngxunya kumngxunya ± 0.075mm ± 0.05mm
  Ubungakanani beHole ± 0.075mm ± 0.05mm
  Ukungqinisisa Ixabiso elingu-0 ≤ 50Ω: ± 5Ω 50Ω ≤ Ixabiso: ± 10% Ω  
Izinto eziphathekayo Ukucaciswa kweBasefilm PI: 3mil 2mil 1mil 0.8mil 0.5mil  
    I-ED &RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ  
  Umthengisi ophambili we-Basefilm Shengyi / Taiflex / Dupont / Doosan / Thinflex  
  Ingcaciso yeCoverlay PI: 2mil 1mil 0.5mil  
  Umbala we-LPI Luhlaza / Mthubi / Mhlophe / Mnyama / Luhlaza / Bomvu  
  PI ukuqina T: 25um ~ 250um  
  Ukuqiniswa kwe-FR4 T: 100um - 2000um  
  US Stiffener T: 100um ~ 400um  
  AL Ukuqinisa T: 100um ~ 1600um  
  Iteyiphu 3M / Tesa / Nitto  
  Ukukhusela i-EMI Ifilimu yesilivere / iCopper / i-inki yesilivere  
Umphezulu wokugqiba OSP 0.1 - 0.3um  
  IHASL Inyoka: 5um - 40um  
  I-HASL (ikhululekile) Inyoka: 5um - 40um  
  ENEPIG Ni: 1.0 - 6.0um  
    Ba: 0.015-0.10um  
    I-Au: 0.015 - 0.10um  
  Ukutyabeka igolide elukhuni Ni: 1.0 - 6.0um  
    I-Au: 0.02um-1um  
  Flash yegolide Ni: 1.0 - 6.0um  
    I-Au: 0.02um - 0.1um  
  ENIG Ni: 1.0 - 6.0um  
    I-Au: 0.015um - 0.10um  
  Ukuntywila isilivere Isiqhelo: 0.1 - 0.3um  
  Nesingxobo Tin Inyoka: 5um - 35um  
I-SMT Chwetheza Izihlanganisi zebala le-0.3mm  
    Inqanaba le-0.4mm iBGA / QFP / QFN  
    Icandelo le-0201