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I-PCB ye-Copper Substrate yokuKhanya kwangaphandle
Ibhodi enye yomaleko, ubukhulu bebhodi:2.0mm;
Ubunzima beCopper obugqityiweyo: 35um,
Gqiba: ENIG
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5.0W/MK High Thermal Conductivity MCPCB Kukukhanya komhlaba
Uhlobo lwesinyithi: Isiseko seAluminiyam
Inani leeleya: 1
Umphezulu:ENIG
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8.0W/mk high thermal conductivity MCPCB yetotshi yoMbane
Uhlobo lwesinyithi: Isiseko seAluminiyam
Inani leeleya: 1
Umphezulu: Khokela iHASL yasimahla
Ipleyiti ubukhulu: 1.5mm
Ubunzima bobhedu: 35um
I-Thermal Conductivity: 8W/mk
Ukumelana nobushushu: 0.015 ℃/W
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Thin Polyimide bendable FPC ene-FR4 stiffener
Uhlobo lwezinto eziphathekayo: i-polyimide
Ubalo lomaleko: 2
Ububanzi obuncinane bokulandelela/isithuba: 4 mil
Ubungakanani bomngxuma omncinci: 0.20mm
Ubunzima bebhodi obugqityiweyo: 0.30mm
Ubunzima bobhedu obugqityiweyo: 35um
Gqiba: ENIG
Umbala wemaski we-Solder: obomvu
Ixesha lokukhokela: iintsuku ezili-10
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Ibhodi ye-6 i-impedance yokulawula i-rigid-flex ibhodi ene-stiffener
Uhlobo lwezinto eziphathekayo: FR-4, polyimide
Ububanzi obuncinane bokulandelela/isithuba: 4 mil
Ubungakanani bomngxuma omncinci: 0.15mm
Ubunzima bebhodi obugqityiweyo: 1.6mm
Ubukhulu be-FPC: 0.25mm
Ubunzima bobhedu obugqityiweyo: 35um
Gqiba: ENIG
Umbala wemaski we-Solder: obomvu
Ixesha lokukhokela: iintsuku ezingama-20
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Resin yokuplaga umngxuma Microvia Ukuntywiliselwa isilivere HDI nge laser sokomba
Uhlobo lwezinto eziphathekayo: FR4
Ubalo lomaleko: 4
Ububanzi obuncinane bokulandelela/isithuba: 4 mil
Ubungakanani bomngxuma omncinci: 0.10mm
Ubunzima bebhodi obugqityiweyo: 1.60mm
Ubunzima bobhedu obugqityiweyo: 35um
Gqiba: ENIG
Umbala wemaski yeSolder: blue
Ixesha lokukhokela: iintsuku ezili-15
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3 oz solder imaski ukuplaga ENEPIG ibhodi yobhedu enzima
Ii-PCB ze-Heavy Copper zisetyenziswa kakhulu kwiinkqubo ze-Electronics zaMandla kunye noBonelelo lwaMandla apho kukho imfuneko ephezulu yangoku okanye kunokwenzeka ukudubula ngokukhawuleza kwesiphoso sangoku. Ubunzima bobhedu obongeziweyo bunokuguqula ibhodi ye-PCB ebuthathaka ibe yindawo eqinile, ethembekileyo, kunye nexesha elide le-wiring kwaye ligatya imfuno yeendleko ezongezelelweyo kunye nezixhobo ezinkulu ezifana ne-Heat sinks, abalandeli, njl.
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fast multilayer High Tg Board kunye nokuntywiliselwa igolide imodem
Uhlobo lwezinto eziphathekayo: FR4 Tg170
Ubalo lomaleko: 4
Ububanzi obuncinane bokulandelela/isithuba: 6 mil
Ubungakanani bomngxuma omncinci: 0.30mm
Ubukhulu bebhodi egqityiweyo: 2.0mm
Ubunzima bobhedu obugqityiweyo: 35um
Gqiba: ENIG
Umbala wemaski yeSolder: eluhlaza"
Ixesha lokukhokela: iintsuku ezili-12
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ukuntywiliselwa kwicala elinye igolide Ceramic esekelwe kwiBhodi
Uhlobo lwezinto eziphathekayo: isiseko se-ceramic
Ubalo lomaleko: 1
Ububanzi obuncinane bokulandelela/isithuba: 6 mil
Ubungakanani bomngxuma omncinci: 1.6mm
Ubunzima bebhodi obugqityiweyo: 1.00mm
Ubunzima bobhedu obugqityiweyo: 35um
Gqiba: ENIG
Umbala wemaski yeSolder: blue
Ixesha lokukhokela: iintsuku ezili-13
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Umthamo ophantsi wonyango we-PCB SMT Assembly
I-SMT sisishunqulelo se-Surface Mounted Technology, eyona teknoloji idumileyo kunye nenkqubo kushishino lweendibano zombane. Isekethe ye-elektroniki ye-Surface Mount Technology (SMT) ibizwa ngokuba yi-Surface Mount okanye i-Surface Mount Technology. Luhlobo lobuchwephesha bendibano yeSekethe efakela izinto ezingenalo lead okanye ezimfutshane ezikhokelayo (i-SMC/SMD ngesiTshayina) kumphezulu weBhodi yeSekethe eShicileleyo (PCB) okanye enye indawo engaphantsi komhlaba, emva koko idityaniswe kwaye idibane ngendlela yokuwelda okanye dip welding.
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jika ngokukhawuleza iprototype yegolide yokubeka iPCB ene-Counter sink hole
Uhlobo lwezinto eziphathekayo: FR4
Ubalo lomaleko: 4
Ububanzi obuncinane bokulandelela/isithuba: 6 mil
Ubungakanani bomngxuma omncinci: 0.30mm
Ugqitywe ubukhulu bebhodi: 1.20mm
Ubunzima bobhedu obugqityiweyo: 35um
Gqiba: ENIG
Umbala wemaski yeSolder: eluhlaza"
Ixesha lokukhokela: 3-4 iintsuku
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I-1.6mm ekhawulezayo yomzekelo we-FR4 PCB
Uhlobo lwezinto eziphathekayo: FR-4
Ubalo lomaleko: 2
Ububanzi obuncinane bokulandelela/isithuba: 6 mil
Ubungakanani bomngxuma omncinci: 0.40mm
Ubunzima bebhodi obugqityiweyo: 1.2mm
Ubunzima bobhedu obugqityiweyo: 35um
Gqiba: khokela iHASL yasimahla
Umbala wemaski ye-Solder: eluhlaza
Ixesha lokukhokela: 8 iintsuku