Umenzi wePCB okhuphisanayo

Isaziso sokubamba "I-Component Failure Analysis Technology and Practice Case" Uhlalutyo lwesicelo ISemina ePhakamileyo

Iziko lesihlanu le-Electronics, uMphathiswa wezoShishino kunye neTekhnoloji yoLwazi

Amashishini kunye namaziko:

Ukuze kuncedwe iinjineli namagcisa enkosi ubunzima bobugcisa kunye nezisombululo zohlalutyo lokusilela kwecandelo kunye nohlalutyo lokusilela kwePCB&PCBA ngelona xesha lifutshane;Nceda abasebenzi abafanelekileyo kwishishini ukuba baqonde ngokucwangcisiweyo kwaye baphucule inqanaba lobugcisa elifanelekileyo ukuqinisekisa ukunyaniseka nokuthembeka kweziphumo zovavanyo.Iziko lesihlanu le-Electronics loMphathiswa woShishino kunye neTekhnoloji yoLwazi (MIIT) labanjwa ngaxeshanye kwi-intanethi nangaphandle kweintanethi ngoNovemba ka-2020 ngokulandelelanayo:

1. Ulungelelwaniso lwe-Intanethi kunye ne-intanethi ye-"Component Failure Analysis Technology and Practical Cases" Uhlalutyo lwesicelo Iworkshop enkulu.

2. Ibanjelwe amacandelo e-elektroniki i-PCB&PCBA yokuthembeka kuhlalutyo lokungaphumeleli kwethekhnoloji yocazululo lwemeko yolungelelwaniso lwe-intanethi kunye ne-offline.

3. Ungqamaniso lwe-intanethi kunye nolungaxhunyiwe kwi-intanethi yovavanyo lokuthembeka kokusingqongileyo kunye nokuqinisekiswa kwesalathisi sokuthembeka kunye nohlalutyo olunzulu lokungaphumeleli kwemveliso ye-elektroniki.

4. Sinokuyila iikhosi kwaye silungiselele uqeqesho lwangaphakathi kumashishini.

Imixholo yoQeqesho:

1. Intshayelelo yokuhlalutya ukungaphumeleli;

2. Itekhnoloji yokuhlalutya ukusilela kwamacandelo e-elektroniki;

2.1 Iinkqubo ezisisiseko zokuhlalutya ukungaphumeleli

2.2 Indlela esisiseko yokuhlalutya okungonakalisi

2.3 Indlela esisiseko yokuhlalutya okutshabalalisayo

2.4 Indlela esisiseko yohlalutyo olutshabalalisayo

2.5 Yonke inkqubo yokuhlalutya imeko yokungaphumeleli

2.6 Ukungaphumeleli kweteknoloji yefiziksi iya kusetyenziswa kwiimveliso ukusuka kwi-FA ukuya kwiPPA kunye ne-CA

3. Izixhobo zohlalutyo lokungaphumeleli okuqhelekileyo kunye nemisebenzi;

4. Iimowudi eziphambili zokungaphumeleli kunye neendlela zokusilela kwezinto ze-elektroniki;

5. Uhlalutyo lokungaphumeleli lwamacandelo amakhulu e-elektroniki, iimeko zakudala zeziphene eziphathekayo (iziphene ze-chip, iziphene zekristale, iziphene ze-chip passivation layer, iziphene ze-bonding, iziphene zenkqubo, iziphene ze-chip bonding, izixhobo ze-RF ezithunyelwa kwamanye amazwe - iziphene ze-thermal structure, iziphene ezikhethekileyo, isakhiwo esingokwemvelo, iziphene zesakhiwo sangaphakathi, iziphene zezinto; Ukumelana, amandla, inductance, diode, triode, MOS, IC, SCR, imodyuli yesekethe, njl.

6. Ukusetyenziswa kokusilela kwitekhnoloji yefiziksi kuyilo lwemveliso

6.1 Amatyala okusilela okubangelwa kuyilo lwesekethe olungafanelekanga

6.2 Iimeko zokungaphumeleli ezibangelwa kukhuseleko olungafanelekanga losasazo lwexesha elide

6.3 Amatyala okusilela okubangelwa kukusetyenziswa ngokungafanelekanga kwamacandelo

6.4 Iimeko zokungaphumeleli ezibangelwa iziphene zokuhambelana kwesakhiwo sendibano kunye nezixhobo

6.5 Iimeko zokungaphumeleli zokuguquguquka kokusingqongileyo kunye neziphene zoyilo lweprofayili yobuthunywa

6.6 Amatyala okusilela okubangelwa kukutshatisa okungafanelekanga

6.7 Amatyala okusilela okubangelwa luyilo olungafanelekanga lokunyamezelana

6.8 Indlela eyindalo kunye nobuthathaka obukhoyo bokhuseleko

6.9 Ukusilela okubangelwa kukuhanjiswa kweparamitha yecandelo

6.10 I-FAILURE iimeko ezibangelwa yi-PCB design defects

6.11 Amatyala okusilela okubangelwa ziziphene kuyilo anokuveliswa