Umenzi wePCB okhuphisanayo

I-SMT sisishunqulelo se-Surface Mounted Technology, eyona teknoloji idumileyo kunye nenkqubo kushishino lweendibano zombane. Isekethe ye-elektroniki ye-Surface Mount Technology (SMT) ibizwa ngokuba yi-Surface Mount okanye i-Surface Mount Technology. Luhlobo lobuchwephesha bendibano yeSekethe efakela izinto ezingenalo lead okanye ezimfutshane ezikhokelayo (i-SMC/SMD ngesiTshayina) kumphezulu weBhodi yeSekethe eShicileleyo (PCB) okanye enye indawo engaphantsi komhlaba, emva koko idityaniswe kwaye idibane ngendlela yokuwelda okanye dip welding.

Ngokubanzi, iimveliso zombane esizisebenzisayo zenziwe nge-PCB kunye nee-capacitors ezahlukeneyo, izixhasi kunye namanye amacandelo e-elektroniki ngokomzobo wesekethe, ngoko ke zonke iintlobo zezixhobo zombane zifuna itekhnoloji yokucubungula itshiphu ye-SMT eyahlukeneyo ukuze iqhubeke.

Izinto ezisisiseko zenkqubo ye-SMT zibandakanya: ukuprintwa kwesikrini (okanye ukusabalalisa), ukuxhoma (ukunyanga), ukugalela i-welding, ukucoca, ukuvavanya, ukulungiswa.

1. Ushicilelo lwesikrini: Umsebenzi woshicilelo lwesikrini kukuvuza i-solder paste okanye ukuncamathisela okuncamathisele kwi-PCB's solder pad ukulungiselela ukuwelda kwamacandelo. Isixhobo esisetyenzisiweyo ngumatshini wokuprinta isikrini (umatshini wokushicilela isikrini), obekwe ekupheleni komgca wemveliso ye-SMT.

2. Glue ukutshiza: Iwisa iglu kwindawo esisigxina PCB ibhodi, kwaye umsebenzi wayo ophambili kukulungisa amacandelo kwibhodi PCB. Izixhobo ezisetyenzisiweyo ngumatshini wokukhupha, obekwe ekupheleni komgca wemveliso ye-SMT okanye emva kwezixhobo zokuvavanya.

3. Intaba: Umsebenzi wayo kukufaka amacandelo endibano yomphezulu ngokuchanekileyo kwindawo emiselweyo yePCB. Isixhobo esisetyenzisiweyo ngumatshini wokubekwa kwe-SMT, obekwe emva komatshini wokushicilela isikrini kumgca wokuvelisa we-SMT.

4. Ukunyanga: Umsebenzi wayo kukunyibilikisa i-adhesive ye-SMT ukwenzela ukuba amacandelo e-surface assembly kunye nebhodi ye-PCB inokubambelela ngokuqinileyo kunye. Izixhobo ezisetyenzisiweyo kukunyanga iziko, ezibekwe ngasemva komgca wemveliso we-SMT SMT.

5. I-welding ye-reflow: umsebenzi we-reflow welding kukunyibilikisa i-solder paste, ukwenzela ukuba amacandelo endibano yomphezulu kunye nebhodi ye-PCB ibambelele ngokuqinileyo. Izixhobo ezisetyenzisiweyo yi-reflow welding furnace, efumaneka kumgca wokuvelisa we-SMT emva komatshini wokubeka i-SMT.

6. Ukucoca: Umsebenzi kukususa intsalela ye-welding efana ne-flux kwi-PCB edibeneyo eyingozi kumzimba womntu. Izixhobo ezisetyenzisiweyo ngumatshini wokucoca, isikhundla asikwazi ukulungiswa, sinokuba se-intanethi, okanye singabikho kwi-intanethi.

7. Ukufunyanwa: Isetyenziselwa ukufumanisa umgangatho we-welding kunye nomgangatho wendibano ye-PCB edibeneyo. Izixhobo ezisetyenzisiweyo ziquka iglasi yokukhulisa, i-microscope, isixhobo sokuvavanya kwi-intanethi (i-ICT), isixhobo sokuvavanya inaliti, uvavanyo oluzenzekelayo lwe-optical (AOI), inkqubo yokuvavanya i-X-ray, isixhobo sokuvavanya ukusebenza, njl. Indawo ingaqwalaselwa kwindawo efanelekileyo inxalenye yomgca wemveliso ngokweemfuno zokuhlolwa.

8.Ukulungisa: isetyenziselwa ukuphinda kusetyenzwe kwakhona iPCB efunyenwe ineziphene. Izixhobo ezisetyenzisiweyo zi-iron ze-soldering, ukulungiswa kweendawo zokusebenza, njl.