Umenzi wePCB okhuphisanayo

I-SMT sisishunqulelo seSurface Mounted Technology, eyona teknoloji idumileyo kunye nenkqubo kushishino lweendibano zombane.Isekethe ye-Electronic Surface Mount Technology (SMT) ibizwa ngokuba yi-Surface Mount okanye i-Surface Mount Technology.Luhlobo lobuchwephesha bendibano yeSekethe efakela iinxalenye zendibano yobuso obungakhokelwayo okanye obufutshane (i-SMC/SMD ngesiTshayina) kumphezulu weBhodi yeSekethe eShicileleyo (PCB) okanye enye indawo engaphantsi komhlaba, emva koko idityaniswe kwaye idityaniswe ngendlela yokuwelda okanye dip welding.

Ngokubanzi, iimveliso zombane esizisebenzisayo zenziwe nge-PCB kunye nee-capacitors ezahlukeneyo, izixhasi kunye namanye amacandelo e-elektroniki ngokomzobo wesekethe, ngoko ke zonke iintlobo zezixhobo zombane zifuna itekhnoloji yokulungiswa kwetshiphu ye-SMT eyahlukeneyo.

Izinto ezisisiseko zenkqubo ye-SMT zibandakanya: ukuprintwa kwesikrini (okanye ukukhupha), ukuxhoma (ukunyanga), ukugalela i-welding, ukucoca, ukuvavanya, ukulungiswa.

1. Ushicilelo lwesikrini: Umsebenzi woshicilelo lwesikrini kukuvuza i-solder paste okanye ukuncamathisela okuncamathiselekayo kwi-PCB's solder pad ukulungiselela ukuwelda kwamacandelo.Izixhobo ezisetyenzisiweyo ngumatshini wokuprinta isikrini (umatshini wokushicilela isikrini), obekwe ekupheleni komgca wemveliso ye-SMT.

2. Glue ukutshiza: Iwisa iglu kwindawo esisigxina PCB ibhodi, kwaye umsebenzi wayo ophambili kukulungisa amacandelo kwibhodi PCB.Isixhobo esisetyenzisiweyo ngumatshini wokukhupha, obekwe ekupheleni komgca wemveliso ye-SMT okanye emva kwezixhobo zokuvavanya.

3. Intaba: Umsebenzi wayo kukufaka amacandelo endibano yomphezulu ngokuchanekileyo kwindawo emiselweyo yePCB.Isixhobo esisetyenzisiweyo ngumatshini wokubeka we-SMT, obekwe emva komatshini wokushicilela isikrini kumgca wokuvelisa we-SMT.

4. Ukunyanga: Umsebenzi wayo kukunyibilikisa i-adhesive ye-SMT ukwenzela ukuba amacandelo endibano yomhlaba kunye nebhodi ye-PCB inokubambelela ngokuqinileyo kunye.Izixhobo ezisetyenzisiweyo kukunyanga iziko, ezibekwe ngasemva komgca wemveliso we-SMT SMT.

5. Ukuwelda kwakhona: umsebenzi we-welding reflow kukunyibilikisa i-solder paste, ukuze amacandelo endibano yomphezulu kunye nebhodi ye-PCB ibambelele ngokuqinileyo.Isixhobo esisetyenzisiweyo sisithando somlilo we-welding, esikumgca wokuvelisa we-SMT emva komatshini wokubeka i-SMT.

6. Ukucoca: Umsebenzi kukususa intsalela ye-welding efana ne-flux kwi-PCB edibeneyo eyingozi kumzimba womntu.Izixhobo ezisetyenzisiweyo ngumatshini wokucoca, isikhundla asikwazi ukulungiswa, sinokuthi sifakwe kwi-intanethi, okanye singabikho kwi-intanethi.

7. Ukufunyanwa: Isetyenziselwa ukufumanisa umgangatho we-welding kunye nomgangatho wendibano ye-PCB edibeneyo.Izixhobo ezisetyenzisiweyo ziquka iglasi yokukhulisa, i-microscope, isixhobo sokuvavanya kwi-intanethi (i-ICT), isixhobo sokuvavanya inaliti, uvavanyo oluzenzekelayo lwe-optical (AOI), inkqubo yokuvavanya i-X-ray, isixhobo sokuvavanya ukusebenza, njl. Indawo ingaqwalaselwa kwindawo efanelekileyo inxalenye yomgca wemveliso ngokweemfuno zokuhlolwa.

8.Ukulungisa: isetyenziselwa ukuphinda kusetyenzwe kwakhona iPCB efunyenwe ineziphene.Izixhobo ezisetyenzisiweyo zi-iron ze-soldering, ukulungiswa kweendawo zokusebenza, njl.