Umenzi wePCB okhuphisanayo

Resin yokuplaga umngxuma Microvia Ukuntywiliselwa isilivere HDI nge laser sokomba

Inkcazelo emfutshane:

Uhlobo lwezinto eziphathekayo: FR4

Ubalo lomaleko: 4

Umkhondo omncinci wobubanzi/isithuba: 4 mil

Ubungakanani bomngxuma omncinci: 0.10mm

Ugqitywe ibhodi ubukhulu: 1.60mm

Ubunzima bobhedu obugqityiweyo: 35um

Gqiba: ENIG

Umbala wemaski yeSolder: blue

Ixesha lokukhokela: iintsuku ezili-15


Iinkcukacha zeMveliso

Iithegi zeMveliso

Uhlobo lwezinto eziphathekayo: FR4

Ubalo lomaleko: 4

Umkhondo omncinci wobubanzi/isithuba: 4 mil

Ubungakanani bomngxuma omncinci: 0.10mm

Ugqitywe ibhodi ubukhulu: 1.60mm

Ubunzima bobhedu obugqityiweyo: 35um

Gqiba: ENIG

Umbala wemaski yeSolder: blue

Ixesha lokukhokela: iintsuku ezili-15

HDI

Ukusukela kwinkulungwane yama-20 ukuya ekuqaleni kwenkulungwane yama-21, ishishini le-elektroniki lebhodi yesekethe liqhuba ixesha lophuhliso olukhawulezayo lobuchwephesha, itekhnoloji ye-elektroniki iye yaphuculwa ngokukhawuleza.Njengeshishini lebhodi yesekethe eprintiweyo, kuphela ngophuhliso lwalo oluhambelanayo, lunokuhlala luhlangabezana neemfuno zabathengi.Ngomthamo omncinci, okhanyayo kunye obhityileyo weemveliso ze-elektroniki, ibhodi yesekethe eprintiweyo iphuhlise ibhodi eguquguqukayo, ibhodi eguquguqukayo eqinile, ibhodi yesekethe yomngxuma oyimfama kunye nokunye.

Ukuthetha ngemingxuma eyimfama / engcwatywe, siqala nge-multilayer yendabuko.Ubume bebhodi yesekethe ye-multi-layer yesekethe yenziwe yisekethe yangaphakathi kunye nesekethe yangaphandle, kwaye inkqubo yokugaya kunye ne-metalization emngxunyeni isetyenziselwa ukuphumeza umsebenzi wokudibanisa kwangaphakathi kwisiphaluka ngasinye.Nangona kunjalo, ngenxa yokunyuka kobuninzi bomgca, imo yokupakisha yamacandelo ihlaziywa rhoqo.Ukuze wenze ummandla webhodi yesekethe ulinganiselwe kwaye uvumele iindawo zokusebenza ezingaphezulu nangaphezulu, ngaphezu kobubanzi bomgca omncinci, i-aperture iye yancitshiswa ukusuka kwi-1 mm ye-DIP jack aperture ukuya kwi-0.6 mm ye-SMD, kwaye iyancipha ngakumbi ukuya ngaphantsi. 0.4mm.Nangona kunjalo, indawo engaphezulu iya kuhlala inabantu, ngoko ke umngxuma ongcwatyiweyo kunye nomngxuma ongaboniyo unokuveliswa.Inkcazo yomngxuma ongcwatywe kunye nomngxuma oyimfama ngolu hlobo lulandelayo:

Umngxuma owakhiweyo:

Umngxuma phakathi kwemigangatho yangaphakathi, emva kokucinezela, ayinakubonwa, ngoko akufuneki ukuba ithathe indawo yangaphandle, amacala angaphezulu nangaphantsi komngxuma angaphakathi kwebhodi, ngamanye amazwi, angcwatywe kwindawo. ibhodi

Umngxuma omfamekileyo:

Isetyenziselwa ukudibanisa phakathi komgangatho ophezulu kunye nenye okanye ngaphezulu kweeleyile zangaphakathi.Elinye icala lomngxuma likwicala elinye lebhodi, kwaye ke umngxuma udityaniswe ngaphakathi ebhodini.

I-advanteji yebhodi yomngxuma emfamekileyo nengcwatywe:

Kwitekhnoloji yomngxunya ongeyo-perforating, ukusetyenziswa komngxuma oyimfama kunye nomngxuma ongcwatyiweyo kunokunciphisa kakhulu ubungakanani bePCB, ukunciphisa inani lamaleya, kuphuculwe ukuhambelana kombane wombane, ukonyusa iimpawu zeemveliso zombane, ukunciphisa iindleko, kunye nokwenza uyilo. sebenza ngokulula kwaye ngokukhawuleza.Kuyilo PCB zemveli kunye nokusetyenzwa, ngokusebenzisa-umngxuma kunokubangela iingxaki ezininzi.Okokuqala, bathatha isixa esikhulu sendawo esebenzayo.Okwesibini, inani elikhulu lemingxuma ephumela kwindawo eshinyeneyo likwabangela imiqobo emikhulu kwiingcingo zomaleko wangaphakathi we-PCB enamaleko amaninzi.Ezi mingxunya zithatha indawo efunekayo yocingo, kwaye zidlula ngokuxineneyo kumphezulu wonikezelo lwamandla kunye nomaleko wocingo lomhlaba, nto leyo eya kutshabalalisa iimpawu zokungaphumeleli komgangatho wombane wombane womhlaba kwaye ibangele ukusilela kombane ophantsi komhlaba. umaleko.Kwaye ukugrumba oomatshini okuqhelekileyo kuya kuba ngamaxesha angama-20 njengokusetyenziswa kwethekhnoloji yomngxuma ongeyena umngxuma.


  • Ngaphambili:
  • Okulandelayo:

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