Ukuveliswa kweebhodi zesekethe ze-PCB ezikumgangatho ophezulu azifuni nje utyalo-mali oluphezulu kwi-teknoloji kunye nezixhobo, kodwa kufuna ukuqokelela amava amagcisa kunye nabasebenzi bemveliso. Kunzima ngakumbi ukusetyenzwa kuneebhodi zesekethe zesiqhelo ezininzi, kwaye umgangatho wayo kunye neemfuno zokuthembeka ziphezulu.
1. Ukukhetha izinto eziphathekayo
Ngophuhliso lwezixhobo ze-elektroniki ezisebenza kakhulu kunye nezinto ezininzi ezisebenzayo, kunye ne-high-frequency kunye ne-high-speed signal transmission, izixhobo zesekethe ze-elektroniki zifuneka ukuba zibe ne-dielectric ephantsi kunye nokulahleka kwe-dielectric, kunye ne-CTE ephantsi kunye nokufunxa kwamanzi aphantsi. . izinga kunye nokusebenza kakuhle okuphezulu kwezixhobo zeCCL ukuhlangabezana neemfuno zokucwangcisa kunye nokuthembeka kweebhodi eziphezulu.
2. Uyilo lwesakhiwo esine-laminated
Izinto eziphambili eziqwalaselwa kuyilo lwesakhiwo se-laminated kukuxhathisa ukushisa, ukumelana nombane, ubungakanani bokuzaliswa kweglue kunye nobukhulu be-dielectric layer, njl. Le migaqo ilandelayo kufuneka ilandelwe:
(1) Abavelisi bebhodi bangaphambi kwangaphambi naphambili kufuneka bahambelane.
(2) Xa umthengi efuna iphepha eliphezulu le-TG, ibhodi engundoqo kunye ne-prepreg kufuneka isebenzise i-TG ephezulu ehambelanayo.
(3) I-substrate yangaphakathi yomaleko yi-3OZ okanye ngaphezulu, kwaye i-prepreg enomxholo ophezulu we-resin ikhethiwe.
(4) Ukuba umthengi akanazo iimfuno ezikhethekileyo, ukunyamezela kobunzima be-interlayer dielectric layer ngokuqhelekileyo kulawulwa ngu +/-10%. Kwiplate ye-impedance, ukunyamezela kwe-dielectric thickness kulawulwa yi-IPC-4101 C / M ukunyamezela kweklasi.
3. Ulawulo lokulungelelaniswa kwe-Interlayer
Ukuchaneka kwembuyekezo yobungakanani bebhodi engundoqo engaphakathi kunye nolawulo lobungakanani bemveliso kufuneka bubuyekezwe ngokuchanekileyo kubungakanani begraphic bomgangatho ngamnye webhodi ephezulu yokunyuka ngokusebenzisa idatha eqokelelwe ngexesha lemveliso kunye namava edatha yembali ethile. ixesha lokuqinisekisa ukwandiswa kunye nokucutheka kwebhodi engundoqo yomaleko ngamnye. ukungaguquguquki.
4. Iteknoloji yesekethe yomaleko wangaphakathi
Ukuveliswa kweebhodi eziphakamileyo, umatshini wokucinga ngokuthe ngqo we-laser (LDI) unokungeniswa ukuphucula isakhono sokuhlalutya imizobo. Ukuze kuphuculwe isakhono etching umgca, kuyimfuneko ukunika imbuyekezo efanelekileyo kububanzi umgca kunye pad kuyilo lobunjineli, kwaye uqinisekise ukuba imbuyekezo uyilo lomgca umaleko yangaphakathi ububanzi, isithuba umgca, ubungakanani umsesane yedwa, umgca ozimeleyo, kunye nomgama wokuya kumgca ufanelekile, kungenjalo tshintsha uyilo lobunjineli.
5. Inkqubo yokucofa
Okwangoku, iindlela zokubeka i-interlayer phambi kwe-lamination zibandakanya ikakhulu: i-slot-slot positioning (i-Pin LAM), i-hot melt, i-rivet, i-hot melt kunye ne-rivet indibaniselwano. Izakhiwo zeemveliso ezahlukeneyo zamkela iindlela ezahlukeneyo zokubeka.
6. Inkqubo yokomba
Ngenxa yobukhulu bomaleko ngamnye, ipleyiti kunye nomaleko wobhedu zityebe kakhulu, eziya kuthi zinxibe ngokunzulu i-drill bit kwaye ziphule ngokulula i-blade drill. Inani lemingxuma, isantya sokulahla kunye nesantya sokujikeleza kufuneka silungiswe ngokufanelekileyo.
Ixesha lokuposa: Sep-26-2022