| Izinto | Ukubanakho |
| ukuhlelwa kwebhodi | Isiseko seAluminiyam, ubhedu Isiseko,isiseko sentsimbi,isiseko se-ceramics copper-clad,Ibhodi yeBade eDityanisiweyo |
| impahla | Kwasekhaya I-aluminiyam, ubhedu lwasekhaya, i-aluminiyam ene-lmported, lmported ubhedu |
| unyango olungaphezulu | HASL / ENIG / OSP / isilivere |
| akhawunti umaleko | ibhodi eprintiweyo kwicala elinye/ibhodi eprintiweyo enamacala amabini |
| maxi.board Ubungakanani | 1200mm*480mm |
| min.board Ubungakanani | 5mm*5mm |
| umkhondo ububanzi/apsce | 0.1mm/0.1mm |
| i-wap kunye ne-twist | <=0.5%(ukutyeba:1.6mm,Ibhodi Ubukhulu: 300mm * 300mm) |
| ubukhulu bebhodi | 0.5mm-5.0mm |
| ubhedu isidenge ubukhulu | 35um/70um/105um/140um/175um/210um /245um/280um/315um/350um |
| Ukunyamezela idigri ye-V-CUT | Umzila we-CNC:±0.1mm;punch:±0.1mm |
| Ukubhaliswa kwe-V-CUT | ±0.1mm |
| Umngxuma udonga lobhedu ubukhulu | 20um-35um |
| Min ukubhaliswa kwendawo yomngxuma (Thelekisa idatha yeCAD) | ±3mil(±0.076mm) |
| Umngxuma wokugqobhoza | 1.0mm ngaphantsi, 1.0mm (Board ubukhulu ngaphantsi kwe-1.0mm, 1.0mm) |
| Min.ukubetha square slot | 1.0mm ngaphantsi, 1.0mm * 1.0mm (Ubukhulu bebhodi bungaphantsi kwe-1.0mm, 1.0mm*1.0mm) |
| Ukubhaliswa kwesekethe eprintiweyo | ±0.076mm |
| Min.drill umngxuma idayamitha | 0.6mm |
Ubunzima bonyango lomhlaba | ukucwenga igolide: Ni 4um-6um, Au0.1um-0.5um ENIG:Ni 5um-6um,Au:0.0254um-0.127um isilivere:Ag3um-8um HASL:40um-100um |
| Ukunyamezela kwe-V-CUTdegree | ±5(iSidanga) |
| V-CUT ibhodi ubukhulu | 0.6mm-4.0mm |
| Min.Lefend ububanzi | 0.15mm |
| Min.Solder imaski ukuvulwa | 0.35mm |