| Hlela | izinto | Ubunakho obuqhelekileyo | Isakhono esikhethekileyo |
| ubalo lomaleko | I-PCB eguquguqukayo eqinile | 2-14 | 2-24 |
| I-Flex PCB | 1-10 | 1-12 | |
| ibhodi | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Min. Ukutyeba | |||
| Max. Ukutyeba | 6mm | 8mm | |
| Max. Ubungakanani | 485mm * 1000mm | 485mm * 1500mm | |
| Umngxuma & Slot | Umngxuma | 0.15mm | 0.05mm |
| Min.Slot Hole | 0.6mm | 0.5mm | |
| Umgangatho wento | 10:01 | 12:01 | |
| Landela umkhondo | Min.Ububanzi / Isithuba | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Ukunyamezelana | Landela iW / S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Umngxuma ukuya kumngxuma | ± 0.075mm | ± 0.05mm | |
| Umngxuma Dimension | ± 0.075mm | ± 0.05mm | |
| Impedance | 0 ≤ Ixabiso ≤ 50Ω : ± 5Ω 50Ω ≤ Ixabiso : ± 10%Ω | ||
| Izinto eziphathekayo | Inkcazo yeBasefilm | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| I-Basefilm Umthengisi oyintloko | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Inkcazo yesigqubuthelo | PI : 2mil 1mil 0.5mil | ||
| Umbala weLPI | Buhlaza / Mthubi / Mhlophe / Mnyama / Bhlowu / Bubomvu | ||
| PI Stiffener | T: 25um ～250um | ||
| FR4 Stiffener | T: 100um ~ 2000um | ||
| SUS Stiffener | T: 100um ~ 400um | ||
| AL Stiffener | T: 100um ~ 1600um | ||
| Iteyiphu | 3M / Tesa / Nitto | ||
| EMI ukukhusela | Ifilimu yesilivere / i-inki yeSilivere | ||
| Ukugqitywa komphezulu | OSP | 0.1 - 0.3um | |
| IHASL | Sn : 5um - 40um | ||
| HASL(Leed free) | Sn : 5um - 40um | ||
| ENEPIG | Ni : 1.0 - 6.0um | ||
| IBa : 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Ukufaka igolide eqinileyo | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 1um | |||
| Igolide ekhanyayo | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 0.1um | |||
| ENIG | Ni : 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| Isilivere eqingqiweyo | Ag : 0.1 - 0.3um | ||
| Ukufaka iTin | Sn : 5um - 35um | ||
| SMT | Uhlobo | 0.3mm pitch Izihlanganisi | |
| 0.4mm pitch BGA / QFP / QFN | |||
| 0201 Icandelo |