Umenzi wePCB okhuphisanayo

I-MCPCB sisishunqulelo se-Metal core PCBs, kubandakanywa i-aluminium esekwe kwi-PCB, i-PCB esekwe elubhedu kunye ne-PCB esekwe ngentsimbi.

Ibhodi esekelwe kwi-Aluminiyam lolona hlobo luqhelekileyo.Izinto ezisisiseko ziquka i-aluminium core, i-FR4 eqhelekileyo kunye nobhedu.Ibonisa umaleko we-thermal clad ochitha ubushushu ngendlela efanelekileyo kakhulu ngelixa ukupholisa amacandelo.Okwangoku, iAluminiyam esekwe kwiPCB ithathwa njengesisombululo kumandla aphezulu.Ibhodi esekelwe kwi-aluminium ingathatha indawo yebhodi esekelwe kwi-ceramic, kwaye i-aluminium inika amandla kunye nokuqina kwimveliso iziseko ze-ceramic zingenako.

I-Copper substrate yenye yezona zixhobo zetsimbi ezibiza kakhulu, kwaye i-thermal conductivity yayo ingcono ngamaxesha amaninzi kune-aluminium substrates kunye ne-iron substrates.Ilungele ukutshatyalaliswa kobushushu obuphezulu beesekethe eziphezulu zefrikhwensi, amacandelo kwimimandla enenguqu enkulu kwiqondo lokushisa eliphezulu neliphantsi kunye nezixhobo zonxibelelwano ezichanekileyo.

I-Thermal insulation layer yenye yeendawo eziphambili ze-copper substrate, ngoko ubukhulu be-foil yobhedu ubukhulu becala yi-35 m-280 m, enokufikelela kumthamo oqinileyo wangoku.Xa kuthelekiswa ne-aluminium substrate, i-copper substrate inokufezekisa umphumo ongcono wokutshatyalaliswa kobushushu, ukwenzela ukuba kuqinisekiswe ukuzinza kwemveliso.

Ubume beAluminiyam PCB

ISekethe yeCopper Layer

Umaleko wobhedu wesekethe uphuhliswa kwaye uhlonyelwe ukwenza isekethe eprintiweyo, i-substrate ye-aluminium inokuthwala umsinga ophakamileyo kune-FR-4 efanayo kunye nobubanzi obufanayo.

I-Insulating Layer

Uluhlu lwe-insulating yi-teknoloji engundoqo ye-aluminium substrate, eyona nto idlala imisebenzi ye-insulation kunye nokushisa ukushisa.I-aluminium substrate insulating layer iyona mqobo omkhulu we-thermal kwisakhiwo semodyuli yamandla.Okungcono ukuhanjiswa kwe-thermal ye-insulating layer, ngokusebenzayo ngakumbi ukusasaza ubushushu obuveliswa ngexesha lokusebenza kwesixhobo, kunye nokunciphisa ubushushu besixhobo,

I-Metal substrate

Luluphi uhlobo lwetsimbi esiya kukhetha njenge-insulating metal substrate?

Kufuneka siqwalasele i-coefficient yokwandisa i-thermal, i-thermal conductivity, amandla, ubunzima, ubunzima, umgangatho womhlaba kunye neendleko ze-substrate yensimbi.

Ngokuqhelekileyo, i-aluminiyam inexabiso eliphantsi kunobhedu.Izinto ezifumanekayo ze-aluminiyam ziyi-6061, 5052, 1060 njalo njalo.Ukuba kukho iimfuno eziphakamileyo ze-thermal conductivity, iipropathi zomatshini, iipropathi zombane kunye nezinye iimpawu ezikhethekileyo, iipleyiti zobhedu, iiplate zetsimbi ezingenasici, iipleyiti zetsimbi kunye neentsimbi ze-silicon nazo zingasetyenziswa.

Ukusetyenziswa kweMCPCB

1. Umsindo : Igalelo, i-amplifier ephumayo, i-amplifier elinganiselayo, isandisi somsindo, isandisi samandla.

2. Ukunikezelwa kwamandla: Ukutshintsha umlawuli, i-DC / AC converter, umlawuli we-SW, njl.

3. I-Automobile: Umlawuli we-elektroniki, ukucima, umlawuli wokubonelela ngombane, njl.

4. Ikhompyutha: Ibhodi ye-CPU, i-floppy disk drive, izixhobo zokubonelela ngombane, njl.

5. IiModyuli zaMandla: I-Inverter, i-slid-state relays, iibhulorho zokulungisa.

6. Izibane kunye nezibane: izibane zokugcina amandla, iintlobo ezahlukeneyo zezibane ze-LED ezinemibala, ukukhanya kwangaphandle, ukukhanya kweqonga, ukukhanya komthombo.