Iimveliso eziphambili
I-PCB yentsimbi
FPC
FR4+Izinziselwe
PCBA
Indawo yesicelo
Iimeko zezicelo zeeMveliso zeNkampani
Isicelo ekukhanyeni kwe-NIO ES8
Isicelo ekukhanyeni kwe-ZEEKR 001
Imodyuli ye-matrix yokukhanya kwentloko ye-ZEEKR 001 isebenzisa i-PCB enecala elinye lobhedu olunobuchwephesha be-thermal vias, eveliswa yinkampani yethu, ephunyezwa ngokugrumba ii-vias ezingaboniyo ngokulawula ubunzulu emva koko utyabeka ngomngxuma wobhedu ukwenza umaleko wesekethe ephezulu kunye nasezantsi. copper substrate conductive, ngaloo ndlela ukuqonda conduction ubushushu. Ukusebenza kwayo kokutshatyalaliswa kobushushu kuphezulu kunebhodi eqhelekileyo yecala elilodwa, kwaye kwangaxeshanye isombulula iingxaki zokutshatyalaliswa kobushushu be-LED kunye ne-ICs, ukuphucula ubomi benkonzo yokukhanya.
Isicelo kwi-ADB headlight of Aston Martin
Inxalenye enye ye-aluminium enecala eliphindwe kabini eveliswe yinkampani yethu isetyenziselwa ukukhanya kwe-ADB kwe-Aston Martin. Xa kuthelekiswa nesibane sentloko esiqhelekileyo, isibane se-ADB sikrelekrele ngakumbi, ngoko ke iPCB inamacandelo amaninzi kunye neengcingo ezintsonkothileyo. Inkqubo yenkqubo yale substrate kukusebenzisa i-double-layer ukusombulula ingxaki yokutshatyalaliswa kobushushu yamacandelo ngexesha elifanayo. Inkampani yethu isebenzisa i-heat-conductive structure kunye nesantya sokutshatyalaliswa kobushushu be-8W / MK kwimigangatho emibini yokukhusela. Ubushushu obuveliswa ngamacandelwana bugqithiselwa nge-vias thermal ukuya kumaleko wokugquma ubushushu kwaye emva koko ukuya ngaphantsi kwe-aluminiyam substrate.
Isicelo kwiziko leprojektha ye-AITO M9
I-PCB efakwe kwi-injini yokukhanya ephakathi esetyenziswa kwi-AITO M9 ibonelelwa sithi, kubandakanywa nokuveliswa kwe-PCB engaphantsi kobhedu kunye nokusetyenzwa kwe-SMT. Le mveliso isebenzisa i-substrate yobhedu kunye ne-teknoloji yokwahlula i-thermoelectric, kwaye ukushisa komthombo wokukhanya kuhanjiswe ngokuthe ngqo kwi-substrate. Ukongezelela, sisebenzisa i-vacuum reflow soldering ye-SMT, evumela ukuba i-solder void rate ilawulwe ngaphakathi kwe-1%, ngaloo ndlela ixazulula ngcono ukuhanjiswa kobushushu be-LED kunye nokwandisa ubomi benkonzo yomthombo wonke wokukhanya.
Ukusetyenziswa kwizibane ezinamandla amakhulu
| Into yokuvelisa | I-Thermoelectric yokwahlula i-substrate yobhedu |
| Izinto eziphathekayo | I-Copper Substrate |
| Uluhlu lweSekethe | 1-4L |
| Gqiba ubukhulu | 1-4mm |
| Ubunzima bobhedu besekethe | 1-4OZ |
| Landela/isithuba | 0.1/0.075mm |
| Amandla | 100-5000W |
| Isicelo | I-Stagelamp, i-accessory yeefoto, izibane zeNdawo |
Flex-Rigid(Metal) isicelo Case
Izicelo eziphambili kunye neenzuzo ze-metal-based Flex-Rigid PCB
→ Isetyenziswa kwizibane zemoto, iitotshi, iprojekti yokubona...
→Ngaphandle kwentambo yokubopha kunye noqhagamshelo lwetheminali, ulwakhiwo lunokwenziwa lula kwaye umthamo womzimba wesibane unokuncitshiswa.
→Uqhagamshelwano phakathi kwePCB ebhetyebhetye kunye nenxalenye engaphantsi icinezelwe kwaye idityaniswe, eyomeleleyo kunodibaniso lweterminal.
Ulwakhiwo oluQhelekileyo lwe-IGBT kunye noLwakhiwo lwe-IMS_Cu
Izinto eziluncedo kwi-IMS_Cu yoLwakhiwo ngaphezulu kwePakeji yeCeramic yeDBC:
➢ I-IMS_Cu PCB ingasetyenziselwa indawo enkulu yocingo olunganyanzelekanga, icutha kakhulu inani loqhagamshelo lweengcingo zebhondi.
➢ Yaphelisa i-DBC kunye nenkqubo ye-copper-substrate welding, ukunciphisa iindleko ze-welding kunye ne-assembly.
➢ I-substrate ye-IMS ifaneleke ngakumbi kwiimodyuli zamandla ezixinaniso eziphezulu ezidityanisiweyo
Umgca wobhedu odityanisiweyo kwi-FR4 PCB eqhelekileyo kunye ne-substrate yobhedu efakwe ngaphakathi kwe-FR4 PCB
Izinto eziluncedo kwiSubstrate yeKopha eLungelelweyo Ngaphakathi Ngaphezu kweMitya yeKopolo eWediweyo kumphezulu:
➢ Ukusebenzisa itekhnoloji yobhedu ebethelelweyo, inkqubo yokuwelda intambo yobhedu iyancitshiswa, ukunyuswa kulula, kunye nokusebenza kakuhle kuyaphuculwa;
➢ Ukusebenzisa itekhnoloji yobhedu ebethelelweyo, ukuchithwa kobushushu kweMOS kusonjululwe ngcono;
➢ Ukuphucula kakhulu umthamo wangoku wokugcwala, ungenza amandla aphezulu ngomzekelo 1000A okanye ngaphezulu.
Imigca yobhedu edityanisiweyo kumphezulu we-aluminium substrate kunye nebhloko yobhedu efakwe ngaphakathi ngaphakathi kwenxalenye yobhedu enecala elinye
Izinto eziluncedo kwiBhloko yeKopha eLungelelweyo Ngaphakathi Ngaphezu kweMitya yeKopolo eWediweyo kumphezulu (kwiPCB yentsimbi):
➢ Ukusebenzisa itekhnoloji yobhedu ebethelelweyo, inkqubo yokuwelda intambo yobhedu iyancitshiswa, ukunyuswa kulula, kunye nokusebenza kakuhle kuyaphuculwa;
➢ Ukusebenzisa itekhnoloji yobhedu ebethelelweyo, ukuchithwa kobushushu kweMOS kusonjululwe ngcono;
➢ Ukuphucula kakhulu umthamo wangoku wokugcwala, ungenza amandla aphezulu ngomzekelo 1000A okanye ngaphezulu.
I-substrate ye-ceramic efakwe ngaphakathi kwe-FR4
Izinto eziluncedo kwi-Ceramic substrate eHlangeneyo:
➢ Ingaba calanye, i-double-side, i-multi-layer, kunye ne-LED drive kunye ne-chips zinokudibaniswa.
➢ Iiseramikhi ze-aluminiyam ze-nitride zifanelekile kwii-semiconductors ezinokumelana nombane ophezulu kunye neemfuno eziphezulu zokulahla ubushushu.
Qhagamshelana nathi:
Yongeza: kuMgangatho we-4, iSakhiwo A, i-2nd West side ye-Xizheng, i-Shajiao Community, i-Humeng Town isixeko sase-Dongguan
Umnxeba: 0769-84581370
Email: cliff.jiang@dgkangna.com
http://www.dgkangna.com
